Test Engineer

Job Description

We are seeking a hands-on Electronics Packaging, Reliability & Test Engineer to lead prototype hardware build, reliability test, and failure analysis in support of the U.S. Army Research Laboratory (ARL) in Adelphi, MD. This role blends electronics packaging, thermal/electrical/mechanical analysis, bench-level testing, and manufacturing/DFM to deliver rugged, field-ready systems.

You’ll collaborate in a multidisciplinary environment (EE, ME, materials, computer science, and research staff) to:

• Package and protect die-level and PCB assemblies using polymerics (adhesives, staking, encapsulation, underfills) and metals (solder alloys, sintered joints),
• Model stresses and failure modes (thermal, electrical, mechanical, vibration),
• Execute rigorous lab and field test campaigns (THB, temperature cycling, vibration, dielectric strength, partial discharge), and
• Perform both destructive and non-destructive analysis to drive design improvements.

This is an excellent fit for engineers who love building, instrumenting, and testing their own designs—and who understand how materials, process, and environment drive reliability.

HII has partnered with ARL for more than 18 years, supporting mission critical R&D, prototyping, and evaluation. This position offers the opportunity to lead technical activities, mentor junior personnel, and contribute directly to impactful, emerging technologies. Come support our work with the U.S. Army Research Laboratory and join a world class team of groundbreaking scientists and engineers!

Test Engineer 2: $80,000 - $115,000

Test Engineer 3: $99,000 - $145,000

Test Engineer 4: $121,000 - $180,000

Essential Job Responsibilities

• Advanced PCB & Module Assembly

• • Assemble and solder complex mixed-signal boards (analog/digital/RF), including SMT and through-hole.
  • Integrate electronics into electromechanical housings, ensuring fit, thermal paths, strain relief, shielding, sealing, and serviceability.
  • Implement packaging best practices: die attach, wire bonding, underfill/encapsulation/staking, conformal coating, and strain mitigation for connectors and harnesses.

• Materials & Process Engineering

• • Select and qualify adhesives (air, bake, UV cure), underfills, potting compounds, coatings, and solder/sintered metallurgical systems based on CTE match, Tg, modulus, outgassing, moisture ingress, electrical performance, and service environment.
  • Define process recipes (surface prep, cure schedules, bake profiles, reflow profiles, bond parameters) and create work instructions.

• Mechanical CAD & Simulation

• • Create mechanical designs and engineering drawings (GD&T) in SolidWorks for custom enclosures, brackets, thermal interfaces, and fixtures.
  • Conduct FEA/Multiphysics modeling in ANSYS Workbench or COMSOL for thermal stress, mechanical stress, electrical stress, and vibration/modal analysis; propose mitigations (stiffeners, damping, isolation, fasteners, fillets/chamfers, materials).

• Manufacturing & DFM

• • Develop DFM guidelines and release designs for CNC machining, sheet metal, injection molding, and 3D printing; coordinate with machine shops/vendors and review NCRs/FAI results.
  • Build/iterate test fixtures and jigs for repeatable assembly and measurement.

• Benchtop & Environmental Testing

• • Set up and operate probe stations, heated stages, temperature-humidity-bias (THB) chambers, and temperature cycling (e.g., -40°C to +85°C) with relevant dwell/ramp profiles.
  • Execute frequency-domain signal analysis (FFT, spectrum analysis) of mixed-signal/RF chains using oscilloscopes, spectrum/network analyzers, and data acquisition.
  • Develop test plans, procedures, and acceptance criteria; capture repeatable datasets and traceability.

• Failure Analysis & Inspection

• • Perform destructive analyses: cross-sectioning, grinding, polishing, optical inspection—document defects (voiding, cracks, delamination, intermetallics, corrosion).
  • Conduct non-destructive analyses: X-ray and Scanning Acoustic Microscopy (SAM/C‑SAM) for voids, bond quality, underfill coverage, and delamination.
  • Drive root cause analysis (RCA) and corrective actions; maintain FA reports and lessons learned.

• Documentation & Lab Ops

• • Author and maintain assembly procedures, test protocols, drawings, BOMs, RCA/FA reports, and engineering memos.
  • Manage lab equipment inventories, calibration schedules, and component stock (Excel/O365); ensure ESD, safety, and quality compliance.

Minimum Qualifications

• 2-9 years relevant experience with Bachelors in related field; 0-7 years relevant experience with Masters in related field; 0-4 years relevant experience with PhD or Juris Doctorate in related field; or High School Diploma or equivalent and 6-13 years relevant experience.
• Test Engineer 2 - 2 years relevant experience with Bachelors in related field; 0 years experience with Masters in related field; or High School Diploma or equivalent and 6 years relevant experience.
• Test Engineer 3 - 5 years relevant experience with Bachelors in related field; 3 years relevant experience with Masters in related field; 0 years experience with PhD or Juris Doctorate in related field; or High School Diploma or equivalent and 9 years relevant experience. 
• Test Engineer 4 - 9 years relevant experience with Bachelors in related field; 7 years relevant experience with Masters in related field; 4 years relevant experience with PhD or Juris Doctorate in related field; or High School Diploma or equivalent and 13 years relevant experience. 
• Demonstrated proficiency in electronics packaging and test, including:

• • Soldering (SMT & through-hole), cable/harness assembly, and PCB rework under microscope.
  • Reading/creating schematics, assembly drawings, BOMs, and work instructions.
  • Setting up and operating lab instrumentation (DMMs, oscilloscopes, spectrum/network analyzers, power supplies, temperature chambers, probe stations).
  • Executing frequency-domain signal analysis for diagnostics and performance verification.
  • Hands-on mechanical aptitude integrating electronics into housings/fixtures.

• Strong Microsoft Office 365 (Excel, Word, PowerPoint, SharePoint/OneDrive) for data, documentation, and collaboration.
• Clearance: Ability to obtain and maintain a SECRET security clearance.

Preferred Requirements

• Packaging & Materials

• • Experience with IPC J-STD-001 and IPC-A-610 workmanship standards.
  • Deep familiarity with adhesives/underfills/encapsulants (cure kinetics, rheology, Tg, modulus, moisture absorption) and solder alloys/sintered joints (wetting, intermetallics, voids, thermal cycling behavior).
  • Wire bonding (ball/wedge) process experience; flip-chip underfill selection & dispensing.
  • Experience with high-dielectric-strength encapsulants and partial-discharge-resistant insulation materials to suppress electric field concentrations and prevent breakdown under extreme high-voltage transient regimes.
  • Experience in developing multi-die electronic power modules (SiC or GaN) utilizing kilovolt(kV)-rated MOSFETs, IGBTs, and diodes.

• CAD/Simulation

• • Proficiency with SolidWorks (assemblies, drawings, GD&T) and ANSYS Workbench/COMSOL Multiphysics for thermal/mechanical/electrical/vibration analysis.
  • Experience with PCB CAD (e.g., Altium) for stack-up, keep-outs, and packaging-aware layouts.

• Manufacturing & DFM

• • Experience delivering hardware via CNC, sheet metal, injection molding, and 3D printing (FDM/SLA/SLS), including DFM, tolerance stack-up, and supplier engagement.
  • Knowledge of fixture design and metrology for repeatable assembly and measurement.

• Reliability & Test

• • Environmental testing (e.g., THB, temp cycling, vibration/modal, high-voltage partial discharge), and data analysis for reliability predictions.
  • Non-destructive evaluation (X-ray, C‑SAM) and destructive FA (cross-sectioning, polish, microscopy).
  • Experience authoring test plans, qualification protocols, and FA/RCA reports.

• Wafer-Level / Cleanroom

• • Exposure to wafer-level processes and cleanroom tools (e.g., lithography, deposition, etch, wire bonders, die attach)—useful for die-to-interposer packaging workflows.

• Field Test Experience

• • Prior support of laboratory and field test events for R&D programs, with a focus on ruggedization and rapid iteration.

Physical Requirements

• Work in office, industrial, and laboratory environments; comfortable with ladders, confined spaces, and temperature variances.
• Fine motor skills for microscope-level assembly (e.g., wire bonding, micro-soldering).
• Ability to lift lab equipment/fixtures and stand at benches for extended periods.